high-precision screens/stencils and jig

The Introduction of Stencil Manufacturing

The Main Stencil Making Methods.

Laser Cutting Stencil

  • The Principle of stencil making by Laser process.
The introduction of high precision YAG and Fiber Laser equipment from Germany to produce high accurately cutting stencil, that is used the ultra-marble platform on the cutting stage to make sure the excellent cutting stability and repeatability. 
  • Advantage: 
One Day Delivery Possible
It is possible for 70Million laser holes cutting.
  • Disadvantage:
The side wall roughness of laser stencil is worse than it of electroforming. It is suitable for 0.25mm pitch and 0.25~0.3mm diameter hole forming. After cutting, it will be treated by post-treatments to ensure the stencil quality and printing quality.


Laser Cutting + C Treatment

  • The principle of C Post Treatment:
The principle of C post treatment is according to “Point Discharge Theory ” to remove the burr and material residues after cutting so that the side wall surface will be treated to smooth and will enhance 60% ink deposits.
  • The Advantage of C Post Treatment :
 It is useful to remove the burr and residues on the edge of cutting hole and also to improve the printing quality. The application is suitable for the 0201 device stencil and advanced Flux/Ball process stencil.
  • The Disadvantage of C Post Treatment :
Added the extra-process time so that increasing the stencil manufacturing cost.

The effect of C Post Treatment while printing

In general, the side wall surface of laser cutting stencil is rough than electroforming stencil so that it is easy to happen the exile ink deposit issue. In order to solve it, C Post Treatment technology from Faithful is designed to make sure the side wall quality and exactly solve "exile ink deposit situation".


Electro Forming Stencil

  • The Principle of stencil making by Electro-forming Process :
T​he fundamental process sequence are, First, Coating photo resist(PR) on the substrate. Second, patterning the layout on the PR layer via photolithography process. Third, put the substrate into electroforming tank, the ion will be follow current direction to accumulate the metal foil, which the metal foil thickness is positive correlation with current density and charge time period.
  • Advantage:
The characteristic of electro-forming process is there is extreme low roughness surface at side wall on the stencil, it can also apply the different post treatment process, such as mirror treatment, taper treatment, that is useful for release ink after printing, and hardness enhanced treatment that it can be harder than SUS over 30% and get longer stencil life over 100k prints as well.
  • Disadvantage:
High Running Cost!  Long Manufacturing Period. The key factors of printing performance are the stability of chemical solution and photolithography process in in-process control.

High Precision Electro-Forming Stencil(Side wall Smooth Treatment)

High Precision Electro-Forming Stencil(Chamfering Edge –N treatment)

Chemical Etching Stencil

  • The principle of stencil making by Etching Process : 
The available materials for Faithful’s Etching Process are SUS304、SUS430、SUS316、SUS420. The fundamental process sequence are, first, coating the Photo-Resist(PR) at the both side of the substrate. Second, follow the photolithography process to pattern the layout. Third, put the patterning substrate into the etching tank until the substrate will be though by etcher. Finally, remove the PR on the substrate.
  • Advantage:
High mechanism stability and low material cost.
  • Disadvantage:
The side wall shape is tapered shape and easy to happen the pin hole within the etching process at large size substrate.
It is hard to control the uniformity of circuitry and depth. And easy to happen the over undercutting issue.

The technical specification of AMOLED Shadow mask

Production Method Super E-Mask
Available Metal Size (mm) 570 x 700 (2500 x 1500 )
Available Design Size(mm) 500 x 500 (2300 x 1300)
Material Ni / Co
Hardness(HV) >450
Thickness Range(um) 20~120
Accumulate Accuracy(um) +/-0.01%
Thickness Accuracy(um) + /-10um@120um Substrate Thickness (Pattern Area)
Minimum Opening Aperture(um) 25um
Minimum Opening Space(um) 25um
Leakage Rate(%) 1/100K
Opening Aperture Accuracy(um) +/-1um
Stretching Tension: 5~34 N
Spec Ratio 1:1
Delivery 7 Days

The comparison table of Traditional Shadow Mask and Faithful Electro-Forming Shadow Mask.

Patten Definition
Item Traditional Shadow Mask Faithful Electro-Forming Shadow Mask
Process Method Chemical Etching Electro-Forming
Process Time Fast(Etching Rate:2.5μm/mins) Slow(Plating Rate:0.1μm/mins)
Surface Roughness (RA) Depend on Raw Material Control
(In-House Technology)
Equipment Requirement Cheap (In-line process) Expansive
(Stand-along Process)
Critical Dimension ≧120μm 25μm
Leakage Rate-
(Open Area: Below 80μm x 120μm)
8/100K 1/100K